功能

• Hirose Denki 2 mm DF59 Series Crimp Socket Housing
• 2 mm DF59 series wire-to-substrate crimp socket housing, low profile connector with 2.48 mm engagement height and compact space-saving design. These DF59 crimp housings use a swing lock mechanism with positive and friction locks. The positive locking mechanism secures the housing to the header, and the click can confirm that the lock is securely engaged. It is electrically connected by the friction lock mechanism, and it can be confirmed that it is engaged securely by the click feeling. This swing lock mechanism provides a secure connection and prevents severe wire routing and wire slippage due to mechanical stress. Contacts for these DF59 series crimp housings are sold separately.
• Features and advantages: Compact, space-saving design Low profile swing lock mechanism with 2.48 mm engagement height with positive and friction locks for secure connection High operating temperature up to 105 °C
• information on product use
• These 2 mm DF59 series multifunctional connectors are ideal for LED lighting applications.